Coating thickness – EDXRF is basically a measuring device for measuring thickness of electroless and electroplating coatings. This coating thickness – EDXRF is designed precisely by using sharp edge technology and latest machines. It is checked for quality under various set norms of the industry. This coating thickness – EDXRF is widely demanded in different industrial applications for its accurate measurement and precise dimensions.
The PICODENTOR® HM500 is an automated nanoindentation measuring system and
employs the instrumented indentation test method according to ISO 14577 and ASTM
E2546. The instrument allows for sophisticated measuring applications with difficult
positioning and is perfectly suitable for measurements in development, quality assurance,
incoming inspection and process control.
Typical fields of application
• Hard material coatings and ultra-thin
• Dirt-repellent coatings
(e. g., Sol-Gel coatings)
• Super-thin paint coatings
• Ion-implanted surfaces
• Nano-coatings on sensors
• Implants/medical applications
• Matrix effects in alloys
• Biological materials
• Ceramic materials
• Hardness determination on microsections
• Automated measurements on multiple
• Coatings on PC hard disks/CDs
Measurable characteristic material quantities
Material characteristics computed according to ISO 14577:
• Martens hardness HM
• Indentation hardness HIT (convertible to
• Modulus of indentation EIT
• Percent elastic portion ??IT of the indentation
• Indentation creep CIT
• ESP – mode, partial load and unload
measurements, for depth-dependant
determination of quantities like EIT, HIT
The Energy Dispersive X-Ray Fluorescence Analysis
(ED-XRFA) is a method for measuring the thickness of coatings and for analysing materials. It can be used for the qualitative and quantitative determination of the elemental composition of a material sample as well as for measuring coatings and coating systems. In both laboratory and industrial environments, this method is now well established and can be readily utilised with modern equipment.
ED-XRFA is a very universal method offering some outstanding advantages. It covers virtually all technically relevant elements and works non-destructively and without contact. Measuring times range in the seconds, rarely longer than one minute. Measurements can be completed quickly and usually without extensive sample preparation. With ED-XRFA, it is possible to measure both thickness and chemical composition of homogeneous materials and coatings. Even traces of harmful substances can be detected in the widest variety of samples.
Moreover, X-ray fluorescence analysis is a very clean method, as no chemicals are used. Due to the protective instrument design, the X-radiation poses no risk for operator or environment: FISCHERSCOPE X-RAY instruments are absolutely safe.
Software Used : WinFTM®
Design Standards : DIN ISO 3497 and ASTM B 568
Measurements on small components and structures on printed circuit boards in sizes up to 610 x 610 mm (24 x 24 in)
Measurements of functional coatings in the electronics and semiconductor industries
XDLM-PCB 210 and 220: Automated measurements, e.g., in quality control
Determining the composition of electroplating bathsGeneral Specification
Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF)
to determine thin coatings, small structures and alloys.
Element range:Chlorine (17) to Uranium U (92) – up to 24 elements simultaneously.
Design:Bench-top unit with housing with a slot on the side
Measuring direction:Top down
High voltage:Three steps: 30 kV, 40 kV, 50 kV
Aperture (Collimator):XDLM-PCB 200/210: Ø 0.1 mm (3.9 mils), optional Ø 0.2 mm (7.9 mils),
slot 0.3 x 0.05 mm (11.8 x 2 mils)
Standard (523-440): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); 0.05 x 0,05 mm
(2 x 2 mils); 0.2 x 0.03 mm (7.9 x 1.2 mils)
Optional (523-366): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); Ø 0.3 mm (11.8
mils); 0.3 x 0.05 mm (11.8 x 2 mils)
Measurement spot:Depending on the measuring distance and on the aperture, the actual
measurement.Spot size is shown in the video image.
Smallest measurement spot:approx. Ø 0.2 mm (7.9 mils)
Measurement distance:0 … 10 mm (0 … 0.4 in) Distance compensation with patented DCM for
simplified measurements at varying distances.For particular applications
or for higher demands on accuracy an additional calibration might be
X-ray detector:Proportional counter tube
Video microscope:High-resolution CCD color camera for optical monitoring of the
measurement location along the primary beam axis, Manual
focusing and auto-focus, Crosshairs with a calibrated scale
(ruler) and spot-indicator, Adjustable LED illumination,Laser
pointer (class 1) to support accurate,specimen placement.
Zoom factor:Digital 1x, 2x, 3x, 4x
Software:Standard: Fischer WinFTM® LIGHT
Optional: Fischer WinFTM® BASIC, PDM®, SUPER
|XDLM-PCB 200||XDLM-PCB 210|
|External dimensions||610 x 750 x 450 mm||With maximum XY travel range:|
1000 x 1265 x 470 mm
(39.4 x 49.8 x 18.5 in)
|Width x depth x height||With extension:|
1200 x 1050 x 450 mm
(47.2 x 41.3 x 17.7 in)
|XY table retracted in home position:|
650 x 810 x 470 mm
(25.6 x 31.9 x 18.5 in)
|Weight||Approx. 86 kg (190 lb)||Approx. 86 kg (190 lb)|
X-ray fluorescence instruments are an advanced range of analyzing instrument which found applications in various industries. These X-ray fluorescence instruments are widely used for analysis of alloys, coating thickness analysis of metal finishing, positive material identification and scrap metal sorting. These work on the principle of X-ray emission and excitement of atoms.
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Fischer Measurement Technologies India Private Limited