Coating Thickness Edxrf

EDXRF for Multilayer Coating Thickness Measurement

EDXRF for Multilayer Coating Thickness Measurement
  • EDXRF for Multilayer Coating Thickness Measurement
  • EDXRF for Multilayer Coating Thickness Measurement

Coating thickness – EDXRF is basically a measuring device for measuring thickness of electroless and electroplating coatings. This coating thickness – EDXRF is designed precisely by using sharp edge technology and latest machines. It is checked for quality under various set norms of the industry. This coating thickness – EDXRF is widely demanded in different industrial applications for its accurate measurement and precise dimensions.

Micro Hardness

Micro Hardness
  • Micro Hardness
  • Micro Hardness

The PICODENTOR® HM500 is an automated nanoindentation measuring system and

employs the instrumented indentation test method according to ISO 14577 and ASTM

E2546. The instrument allows for sophisticated measuring applications with difficult

positioning and is perfectly suitable for measurements in development, quality assurance,

incoming inspection and process control.

Typical fields of application

• Hard material coatings and ultra-thin

DLC coatings

• Dirt-repellent coatings

(e. g., Sol-Gel coatings)

• Super-thin paint coatings

• Ion-implanted surfaces

• Nano-coatings on sensors

• Implants/medical applications

• Matrix effects in alloys

• Biological materials

• Ceramic materials

• Hardness determination on microsections

• Automated measurements on multiple

samples

• Coatings on PC hard disks/CDs

Measurable characteristic material quantities

Material characteristics computed according to ISO 14577:

• Martens hardness HM

• Indentation hardness HIT (convertible to

HV)

• Modulus of indentation EIT

• Percent elastic portion ??IT of the indentation

work Welast/Wtotal

• Indentation creep CIT

• ESP – mode, partial load and unload

measurements, for depth-dependant

determination of quantities like EIT, HIT


Additional Information:

XRF Coating Thickness Measurement

XRF Coating Thickness Measurement
  • XRF Coating Thickness Measurement
  • XRF Coating Thickness Measurement

The Energy Dispersive X-Ray Fluorescence Analysis

(ED-XRFA) is a method for measuring the thickness of coatings and for analysing materials. It can be used for the qualitative and quantitative determination of the elemental composition of a material sample as well as for measuring coatings and coating systems. In both laboratory and industrial environments, this method is now well established and can be readily utilised with modern equipment.

ED-XRFA is a very universal method offering some outstanding advantages. It covers virtually all technically relevant elements and works non-destructively and without contact. Measuring times range in the seconds, rarely longer than one minute. Measurements can be completed quickly and usually without extensive sample preparation. With ED-XRFA, it is possible to measure both thickness and chemical composition of homogeneous materials and coatings. Even traces of harmful substances can be detected in the widest variety of samples.

Moreover, X-ray fluorescence analysis is a very clean method, as no chemicals are used. Due to the protective instrument design, the X-radiation poses no risk for operator or environment: FISCHERSCOPE X-RAY instruments are absolutely safe.


Additional Information:

PCB Coating Thickness Measurement Gauge: XDV-Micro PCB

PCB Coating Thickness Measurement Gauge: XDV-Micro PCB
  • PCB Coating Thickness Measurement Gauge: XDV-Micro PCB
  • PCB Coating Thickness Measurement Gauge: XDV-Micro PCB

Coating thickness measurement gauge for connectors XULM is available in various technical specifications. These are robust entry-level X-ray fluorescence measuring instruments for non-destructive material analysis and coating thickness measurement. Compact sized these devices are extensively acclaimed for their consistent performance, outstanding accuracy and longer service life. These are widely used for the non-destructive coating thickness measurement and material analysis.

Fischer XRF Analyzer

Fischer XRF Analyzer
  • Fischer XRF Analyzer
  • Fischer XRF Analyzer
  • Fischer XRF Analyzer

These are extensively acknowledged as specific X-ray fluorescence measuring instruments for measurements and analyses of coating thicknesses and compositions on printed circuit boards. These are acclaimed for its longer service life and outstanding accuracy.

Software Used : WinFTM®
Design Standards : DIN ISO 3497 and ASTM B 568

TYPICAL FIELDS OF APPLICATION

Measurements on small components and structures on printed circuit boards in sizes up to 610 x 610 mm (24 x 24 in)

Measurements of functional coatings in the electronics and semiconductor industries

XDLM-PCB 210 and 220: Automated measurements, e.g., in quality control

Determining the composition of electroplating baths

General Specification

 

Intended use:Energy dispersive x-ray fluorescence measuring instrument (EDXRF)

 to determine thin coatings, small structures and alloys.


Element range:Chlorine (17) to Uranium U (92) – up to 24 elements simultaneously.


Design:Bench-top unit with housing with a slot on the side


Measuring direction:Top down


X-Ray Source

 

X-ray tube:


High voltage:Three steps: 30 kV, 40 kV, 50 kV


Aperture (Collimator):XDLM-PCB 200/210: Ø 0.1 mm (3.9 mils), optional Ø 0.2 mm (7.9 mils),

 slot 0.3 x 0.05 mm (11.8 x 2 mils)


 Standard (523-440): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); 0.05 x 0,05 mm

 (2 x 2 mils); 0.2 x 0.03 mm (7.9 x 1.2 mils)


 Optional (523-366): Ø 0.1 mm (3.9 mils); Ø 0.2 mm (7.9 mils); Ø 0.3 mm (11.8

 mils); 0.3 x 0.05 mm (11.8 x 2 mils)


Measurement spot:Depending on the measuring distance and on the aperture, the actual

 measurement.Spot size is shown in the video image.

 Smallest measurement spot:approx. Ø 0.2 mm (7.9 mils)


Measurement distance:0 … 10 mm (0 … 0.4 in) Distance compensation with patented DCM for

 simplified measurements at varying distances.For particular applications

 or for higher demands on accuracy an additional calibration might be

 necessary.

X-Ray Detection

 

X-ray detector:Proportional counter tube


Sample Alignment

 

Sample positioning:Manually


Video microscope:High-resolution CCD color camera for optical monitoring of the

 measurement location along the primary beam axis, Manual

 focusing and auto-focus, Crosshairs with a calibrated scale

 (ruler) and spot-indicator, Adjustable LED illumination,Laser

 pointer (class 1) to support accurate,specimen placement.


Zoom factor:Digital 1x, 2x, 3x, 4x


Evaluation Unit

 

Computer:Windows®-PC


Software:Standard: Fischer WinFTM® LIGHT

 Optional: Fischer WinFTM® BASIC, PDM®, SUPER


Dimensions

 

Dimensions
XDLM-PCB 200XDLM-PCB 210
External dimensions610 x 750 x 450 mmWith maximum XY travel range:
1000 x 1265 x 470 mm
(39.4 x 49.8 x 18.5 in)
Width x depth x heightWith extension:
1200 x 1050 x 450 mm
(47.2 x 41.3 x 17.7 in)
XY table retracted in home position:
650 x 810 x 470 mm
(25.6 x 31.9 x 18.5 in)
WeightApprox. 86 kg (190 lb)Approx. 86 kg (190 lb)

X-Ray Fluorescence Instrument

X-Ray Fluorescence Instrument
  • X-Ray Fluorescence Instrument
  • X-Ray Fluorescence Instrument

ED-XRF Spectrometer

 


X-ray fluorescence instruments are an advanced range of analyzing instrument which found applications in various industries. These X-ray fluorescence instruments are widely used for analysis of alloys, coating thickness analysis of metal finishing, positive material identification and scrap metal sorting. These work on the principle of X-ray emission and excitement of atoms.


Additional Information:

Portable XRF Spectrometer

Portable XRF Spectrometer
  • Portable XRF Spectrometer
  • Portable XRF Spectrometer

  1. FISCHERSCOPE® X-RAY XAN® 500
Mobile X-RAY Fluorescence Measuring Instrument for Fast and Non-Destructive Material Analysis and Coating Thickness Measurement

The FISCHERSCOPE X-RAY XAN 500 is a mobile and universally applicable energy dispersive x-ray fluorescence measuring instrument. It is well suited for the non-destructivecoating thickness measurement and material analysis. The instrument is perfectly suitable for measurements in quality assurance, incoming inspection and process control. Thanks to its small size, you can measure even on difficult geometries.
Typical fields of application:
• Measurements on large coated parts, like Machine components and housings• Mobile measurements in electroplating shops• Mobile measurements of precious metals• Determination of the metal content of electroplating baths (Solution analysis)Outstanding accuracy and long-term stability are characteristics of all FISCHERSCOPEX-RAY systems. The necessity of recalibration is considerably reduced, saving time and effort. The modern silicon drift detector achieves high accuracy and good detection sensitivity.The fundamental parameter method by FISCHER allows for the analysis of solid and liquid specimens as well as coating systems without calibration.

Additional Information:

Material Analysis Instrument

Material Analysis Instrument

For exact material analysis, the broad assortment of Fischer X-ray fluorescence instruments (XRF) offers the optimal instrument for any application.

Trace analysis required by ROHS, testing of jewelry and gold or inline measurements in continuous production – FISCHERSCOPE X-RAY instruments fulfil the requirements in the laboratory and in manufacturing

Additional Information:
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    Rakesh Bhan

    (Managing Director)

    Fischer Measurement Technologies India Private Limited

    Hinjawadi, Pune, Maharashtra, India

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