Coating thickness measurement gauge for connectors - XDLM237 is engineered using best available techniques and following international industrial standard. These are X-ray fluorescence measuring instrument for manual or automated coating thickness measurements and analysis on PC-boards, electronics components and mass-produced parts, even on small structures. These are widely used for the measurement and analysis of thin coatings, even at small concentrations. These are acclaimed for its effective usage and longer service life.
MODELSXDLM 231: Plane support stage, motor-driven Z-axis
XDLM 232: Manually operable XY-stage, motor-driven Z-axis
XDLM 237: Motor-driven XY-stage that moves into the loading position automatically, when the protective hood is opened. Motor-driven programmable Z-axis
TYPICAL FIELDS OF APPLICATIONMeasurement of electroplated mass-produced parts
Inspection of thin coatings, e.g., decorative chromium-plating
Analysis of functional coatings in the electronics and semiconductor industries
Automated measurements, e.g., on printed circuit boards
General SpecificationIntended use:Energy dispersive X-ray fluorescence measuring instrument (EDXRF)
to determine thin coatings and alloys.

Element range:Aluminum Al (13) to Uranium U (92) – up to 24 elements simultaneously.

Design:Bench-top unit with hood opening upwards
XY-stage and Z-axis electrically driven and programmable
Motor-driven changeable apertures and filters
Video camera and laser pointer (class 1) for orienting the sample

Measuring direction:Top down

X-Ray SourceX-ray tube:Micro focus tungsten tube with beryllium window

High voltage:Three steps 10 kV, 30 kV, 50 kV

Aperture (Collimator):4x changeable: Ø 0.1 mm (3.9 mils), Ø 0.3 mm (11.8 mils), Ø 0.6 mm
(23.6 mils) slot 0.5 x 0.15 mm (19.7 x 5.9 mils), others on request

Primary filter:3x changeable (Standard configuration: Nickel, Aluminum, no filter)

Measurement spot:Depending on the measuring distance and on the aperture, the actual
measurement spot size is shown in the video image. Smallest measurement
approx. Ø 0.15 mm (5.9 mils) with aperture 0.1 mm (3.9 mils)

X-Ray DetectionX-ray detector:Silicon PIN detector with peltier cooling

Resolution (fwhm for Mn-Kα):≤ 200 eV

Measurement distance:0 … 80 mm (0 … 3.2 in) Distance compensation with patented DCM method
for simplified measurements at varying distances. For particular applications
or for higher demands on accuracy an additional calibration might be
necessary.

Sample AlignmentVideo microscope:High-resolution CCD color camera for optical monitoring of the
measurement location along the primary beam axis,manual focusing
and auto-focus, crosshairs with a calibrated scale (ruler) and spot-
indicator,adjustable LED illumination, laser pointer (class 1)
to support accurate sample placement.

Zoom factor:Digital 1x, 2x, 3x, 4x

Sample StageDesign: Programmable, motor-driven XY-stage

Maximum travel: X/Y-axis: 255 x 235 mm (10 x 9 in); Z-axis: 140 mm (5 in)

Max. travel speed: 80 mm/s (3.2 in/s)

Repeatability precision XY: ≤ 0.01 mm (0.4 mils), unidirectional

Usable sample Width x depth [mm]: 300 x 350 mm, [in]: 12 x 14
placement area:

Max. sample weight: 5 kg, with reduced approach travel precision 20 kg

Max. sample height: 140 mm (5.5 in)

Electrical DataPower supply:AC 115 V or AC 230 V 50 / 60 Hz

Power consumption:Max. 120 W ,without evaluation PC

Protection class:IP40